Protective enclosure for an electronic device

ABSTRACT

A protective enclosure for use with an electronic device includes a cushion layer configured to cover at least a portion of the side surfaces of the electronic device when the electronic device is installed in the protective enclosure; and a structural layer affixed to the cushioning layer, the structural layer having a back portion, a top portion, a right wall portion, and a left wall portion, the back portion having a first portion having a thickness that is less than a thickness of a second portion of the back portion, the first portion configured to allow a section of the protective enclosure to flex relative to the back surface of the electronic device during installation and removal of the electronic device from the protective enclosure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/671,238, filed Aug. 8, 2017, which is a continuation of U.S. patentapplication Ser. No. 15/297,784, filed Oct. 19, 2016, which is acontinuation of U.S. patent application Ser. No. 15/040,713, filed Feb.10, 2016, which is a continuation of U.S. patent application Ser. No.14/591,537, filed Jan. 7, 2015, which claims benefit to U.S. ProvisionalPatent Application No. 61/924,423, filed on Jan. 7, 2014, the contentsof which are hereby incorporated by reference in their entireties.

BACKGROUND

Various types of electronic devices are used for communication andentertainment purposes. These devices include computers, tablets, audioplayers, video players, smart phones, two-way radios, and GPS receivers.These devices often include touch screens, keyboards, scroll wheels,switches, or other interactive controls. Due to the sensitive nature andhigh cost of these electronic devices, it is desirable to protect thesedevices from physical damage that can result from everyday usage.

Many two-piece and three-piece protective enclosures exist and providecushion and structural layers for electronic device protection. However,many of these cases require a user to follow a relatively complicatedset of instructions to assemble the multi-piece protective enclosurearound the electronic device. To avoid these assembly steps, it isdesirable to provide a one-piece protective enclosure that provides easyinstallation and removal and equal or superior protective benefits asthe multi-piece protective solutions.

SUMMARY

In one aspect, a protective enclosure for an electronic device isprovided. The electronic device can be a device that needs protectionfrom droppage and mishandling and/or damage. The electronic device canbe a mobile phone or tablet computer. The electronic device can also bea digital assistant, a computer, a camera, music player, GPS device, orthe like.

The electronic device can have a front surface. The front surface of theelectronic device can comprise a capacitive sensing touch screen. Inother embodiments, the front surface of the electronic device can have akeyboard or buttons along with a touch screen or other display. Theelectronic device can have a back surface and together with the frontsurface the electronic device can be surrounded by a perimeter portion.

The electronic device can have side surfaces. The side surfaces caninclude a top-side surface, a bottom-side surface and opposing sidesurfaces. The side surfaces along with the front surface and bottomsurface provide the housing of the electronics, battery, and othercomponents of the electronic device. The side surfaces of the electronicdevice can have additional features of the electronic device, includingbuttons and controls and access points.

The electronic device can have buttons and controls that along with thetouch screen make the electronic device function fully. The buttons onthe electronic device can be a power button, can be volume controls, canbe a silencing toggle, and in some instances the buttons can be akeyboard or other controls for enabling the electronic device tofunction.

The electronic device can have a camera. The camera can be located on asurface of the electronic device and in some instances can be located onthe back surface of the electronic device. The camera can include aflash and in some instances other features might be located near thecamera of the electronic device, including a speaker, microphone, orother sensors.

The electronic device can have a speaker. The speaker can be located ona surface of the electronic device and in some instances can be locatedalong a perimeter surface of the electronic device and on a bottomsurface of the electronic device. The electronic device can also haveaccessible areas for power connections and for headphone connections.These areas can be located along a surface of the electronic device andin some instances be located on the bottom surface of the electronicdevice.

The protective enclosure is configured such that the electronic devicecan fit within the protective enclosure and be protected from drops,shocks, damage, misuse, and the like. In certain instances, theprotective enclosure can include a bottom shell. In certain instances,the bottom shell can have an elongated body that has a surfacesurrounded by a perimeter portion. In some embodiments, the perimeterportion can include a retaining wall that can extend from the surface ofthe bottom shell. In some embodiments, the retaining wall can have atop-side wall portion, a bottom-side wall portion, a left side wallportion, and right side wall portion. In other instances, the retainingwall can have only a top-side wall portion, only a bottom-side wallportion, or only side wall portions. In other instances, the retainingwall can have a combination of a top-side wall portion and a side wallportion, or a bottom-side wall portion and a side wall portion. And inother instances, the retaining wall can only have side wall portions.

In certain embodiments, the wall portions and the surface of the bottomshell can create a cavity. The cavity of the bottom shell can retain andhouse the electronic device and the cavity can be shaped similar to theshape of the electronic device. In certain embodiments, the cavity ofthe bottom shell can be shaped to fit a mobile phone. In otherinstances, the bottom shell can be shaped to fit a tablet computer, acamera, a music player, a GPS device, or the like.

In certain embodiments, the wall portions of the bottom shell can be thesame height as the side portions of the electronic device. The wallportions can also be a portion of the height of the side portions of theelectronic device. In other embodiments, the wall portions of the bottomshell can only be a small portion of the side portions of the electronicdevice, only wrapping around the change in surface from the back of theelectronic device to the side surface of the electronic device.

In certain embodiments, the elongated body of the bottom shell can havean inner surface and an outer surface. The outer surface can be thesurface that a user of the electronic device feels when the electronicdevice is installed into the protective enclosure. In certain instances,the outer surface of the bottom shell can extend around to the top-sidewall portion, the bottom-side wall portion, and the side wall portionsof the bottom shell. In other embodiments, the outer surface of thebottom shell of the protective enclosure can extend around only thetop-side wall portion, only the bottom-side wall portion, only the sideportions, or in other embodiments a combination of the wall portions ofthe bottom shell.

In certain embodiments, the bottom shell of the protective enclosure canhave one or more cut out regions. The cut out regions can be locatedalong the left side wall portion and the right side wall portion. Inother instances, the cut out regions can be located on the top-side wallportion and/or the bottom-side wall portion. The cutouts can be the sizeof a portion of one of the wall portions of the bottom shell or the cutout regions can be the entire size of one of the wall portions of thebottom shell that the cutout is located. In other instances, one cut outregion of the bottom shell can be a different size than another cutoutof the bottom shell in the same protective enclosure.

The cut out regions of the bottom shell of a protective enclosure can beadapted to accommodate an overmolded material to fill in the cut outregions. In certain embodiments, the cutouts are located along the leftand right side walls of the bottom shell to accommodate a bending of thebottom shell along the elongated body of the bottom shell. In certainembodiments, the bending of the bottom shell can assist with insertingan electronic device into the protective enclosure.

In certain embodiments, the bottom shell of the protective enclosure canhave a thinner region along the bottom shell. The thinner region canextend along a portion of the bottom shell or can extend along theentire length of the bottom shell. In some instances, the thinner regioncan extend from one cut out region on the left side wall portion to theother cut out region on the right side wall portion. In certaininstances, the thinner region can a region of the protective enclosureto flex away from the back of the electronic device during installationand removal of the electronic device.

The cut out regions of the bottom shell can accommodate access to thefunctional aspects and control features of an electronic device. The cutout regions can be positioned along the wall portions on the bottomshell to provide access to the volume controls, the silence toggleswitch, the power button, and the like of the electronic device. Whenaligned with a control feature of the electronic device, the cut outregion allows functional access to the control feature of the electronicdevice while the electronic device remains housed and retained withinthe protective enclosure.

In certain embodiments, the bottom shell of the protective enclosure canhave a camera feature and camera opening. The camera feature can belocated on the outer surface of the bottom shell and in some instancescan be aligned with the camera of an electronic device. The cameraopening can be the same shape as the camera of the electronic device orin certain embodiments can be larger than the size of the camera of theelectronic device.

In certain embodiments, the camera feature of the bottom shell can bealigned with the camera of a tablet computer or can be aligned with thelens portion of a camera. The camera feature can be of the same materialand color of the bottom shell or in other instances can be a specificcolor to prevent any distortion of the camera usage of the electronicdevice when the electronic device is retained in the protectiveenclosure. In some instances, the color of the camera feature can beblack or a dark color as to not interfere with the quality of the cameraof the electronic device. In other embodiments, the camera feature ofthe bottom shell of the protective enclosure can include a lens, a lensgasket, and a flash. The lens, lens gasket, and flash of the protectiveenclosure can help to protect the camera of the electronic device andcan also assist to enhance the quality of a camera when the electronicdevice is housed and retained within the protective enclosure.

In certain embodiments, the bottom shell of the protective enclosure canhave a protrusion on the inner surface of the bottom shell. Theprotrusion can be shaped to interact with a feature of the protectiveenclosure, and in some embodiments can interact with on overmolded layerthat fits on the inner surface of the bottom shell of the protectiveenclosure.

In certain embodiments, the protective enclosure can include a firstcushioning layer. The first cushioning layer can comprise a frontsurface and a back surface. In certain embodiments the first cushioninglayer can have a proximal portion, a distal portion, and side portions.In certain embodiments, the first cushioning layer can have an elongatedbody defined by the shape of the front surface and of the back surface.

The back surface of the first cushioning layer of certain embodiments ofthe protective enclosure can be overmolded onto the inner surface of thebottom shell and create a back portion of the protective enclosure thathouses an electronic device. In other embodiments, the first cushioninglayer can be overmolded onto the inner surface of the bottom shell alongthe top-side wall portion, along the bottom-side wall portion, along theleft side wall portion and along the right side wall portion, or anyvariation of the wall portions.

In certain embodiments, the front surface of the first cushioning layercan rest against the back surface of the electronic device and provideprotection to the electronic device when installed into the protectiveenclosure.

In other embodiments the first cushioning layer can have a depression onthe back surface. The depression can interact or engage with theprotrusion or nub in the inner surface of the bottom shell. Thedepression and protrusion can interact to assist with alignment duringthe overmolding process between the bottom shell and the firstcushioning layer of the protective enclosure.

In certain embodiments, the protective enclosure can include a secondcushioning layer. The second cushioning layer can also act as aframework member for the protective enclosure that retains an electronicdevice.

The framework member can have a surface that is surrounded by aperimeter portion. The perimeter portion can also be considered aperimeter wall. The perimeter wall can include a top wall portion, abottom wall portion, and opposing side wall portions. In otherembodiments, the perimeter portion can only include a top wall portion,or can only include a bottom wall portion, or can only include opposingside wall portions, or any combination of wall portions.

In certain embodiments, the perimeter portion of the framework membercan be overmolded with the retaining wall of the bottom shell. Theperimeter portion of the framework member can be adapted to form-fitover a perimeter portion of the electronic device. The framework membercan be formed to create an elevated protective rim around the perimeterof the electronic device, creating a gap between the front face of theelectronic device and a surface that the protective enclosure may reston.

In certain embodiments, the overmolding of the bottom shell, the firstcushioning layer and the second cushioning layer can make thesecomponents of the protective enclosure inseparable and can make theprotective enclosure a one-piece article. The second cushioning layercan have an expanded portion along the side wall portions of the secondcushioning layer. The expanded portions can be overmolded to fit withinthe cut out regions on the bottom shell and in some embodiments theexpanded portions can bend along the perimeter portion of the bottomshell and the second cushioning layer and bend the protective enclosureso as to insert or remove an electronic device more easily.

In certain embodiments, the framework member can be multiple componentsthat overmold onto the bottom shell. The multiple components can becomprised of a top component, a bottom component, and side components.The protective enclosure can include one or more than one of theindividual components of the framework member that overmold onto thebottom wall and comprise the protective enclosure that surrounds andhouses the electronic device.

In certain embodiments, the framework member can include a plurality ofopenings. The openings in the framework member or an individualcomponent of the framework member can be located on any wall portion ofthe framework member and in some instances can be located along thebottom wall portion of the second cushioning layer or framework member.The openings in the framework member can provide access to a componentof the electronic device.

In some embodiments the openings can provide access to a power port,headphone jack port, or a silencing toggle of the electronic device.When the framework member is overmolded with the bottom shell of theprotective enclosure, the openings of the framework member or secondcushioning layer can be located within the cut out regions of the bottomshell.

In certain embodiments, the framework member can include a soundfeature. This sound feature can be located in the same location as thespeaker of the electronic device when the electronic device is insertedinto the protective enclosure. The sound feature of the framework membercan provide access to the sound emitted from the electronic device. Inother instances, the sound feature of the framework member, or secondcushioning layer, can be located near the volume controls of theelectronic device. When the electronic device is housed within theprotective enclosure, the sound features of the second cushioning layercan be engaged to interact with the volume controls of the electronicdevice and volume can be increased or decreased by engaging the soundfeatures of the second cushioning layer.

In certain embodiments, the sound features of the second cushioninglayer are located within the cut out regions on the bottom wall when thebottom wall and second cushioning layer are overmolded together as theprotective enclosure. By having the sound features located within thecut out regions of the bottom wall, the volume controls are easilyengaged thru the second cushioning layer and can be easily depressed inorder to change the volume of the electronic device when housed withinthe protective enclosure.

In certain embodiments, the second cushioning layer of the protectiveenclosure can include a control feature. The control feature can belocated on any wall portion of the second cushioning layer, or frameworkmember, and in some instances can be located on a side wall portion.When the electronic device is retained within the protective enclosure,the control feature of the framework member can be located over thepower button of the electronic device. The power button of theelectronic device can then be activated through the framework member, orsecond cushioning layer, while retaining the electronic device withinthe protective enclosure.

In some embodiments, the control feature of the second cushioning layercan be located within the cut out region of the bottom shell whenovermolded together to make the protective enclosure. Having the controlfeature within the cut out region of the bottom wall allows for thesecond cushion layer to interact with the power button and engage thebutton to turn the electronic device, which in some instances can be amobile phone, on and off.

In one exemplary embodiment, a protective enclosure for use with anelectronic device having a front surface, a back surface, and sidesurfaces is provided. The protective enclosure includes a cushion layerand a structural layer affixed to the cushioning layer. The cushionlayer is configured to cover at least a portion of the side surfaces ofthe electronic device when the electronic device is installed in theprotective enclosure. The structural layer has a back portion, a topportion, a right wall portion, and a left wall portion. The back portionhas a first portion having a thickness that is less than a thickness ofa second portion of the back portion, the first portion configured toallow a section of the protective enclosure to flex relative to the backsurface of the electronic device during installation and removal of theelectronic device from the protective enclosure.

In one exemplary embodiment, a protective enclosure for use with anelectronic device having a front surface, a back surface, and sidesurfaces is provided. The protective enclosure includes a cushion layerand a bottom shell affixed to the cushioning layer. The cushion layer isconfigured to cover at least a portion of the side surfaces and at leasta portion of the back surface of the electronic device when theelectronic device is installed in the protective enclosure. The bottomshell has a back portion, a top portion, a right wall portion, and aleft wall portion. The back portion has a thinner region having athickness that is less than a thickness of a thicker region of the backportion, the thinner region configured to permit a section of theprotective enclosure to flex relative to another section of theprotective enclosure during installation and removal of the electronicdevice from the protective enclosure.

In one exemplary embodiment, a protective enclosure for use with anelectronic device having a front surface, a back surface, and sidesurfaces is provided. The protective enclosure includes a structurallayer defining a cavity configured to receive the electronic device anda cushion layer overmolded within the cavity of the structural layer.The structural layer includes a back portion and a plurality of wallportions. The back portion is configured to cover at least a portion ofthe back surface of the electronic device when the electronic device isinstalled in the protective enclosure. The wall portions are configuredto cover at least a portion of the side surfaces of the installedelectronic device. The structural layer includes a first region having athickness that is less than a thickness of a second region of the backportion. The cushion layer is configured to cover at least a portion ofthe side surfaces and at least a portion of the back surface of theelectronic device when the electronic device is installed in theprotective enclosure.

The details of one or more variations of the subject matter describedherein are set forth in the accompanying drawings and the followingdescription.

BRIEF DESCRIPTIONS OF DRAWINGS

FIG. 1 is a rear isometric view of a protective enclosure for anelectronic device;

FIG. 2A is a bottom-facing rear isometric view of a protective enclosurefor an electronic device;

FIG. 2B is a top-facing rear isometric view of a protective enclosurefor an electronic device;

FIG. 3A is a half-section front isometric view of a protective enclosurefor an electronic device;

FIG. 3B is a front isometric view of a protective enclosure for anelectronic device;

FIG. 4 is a side view of a protective enclosure for an electronicdevice;

FIG. 5 is a front isometric section view of a protective enclosure foran electronic device;

FIG. 6 is a side section view of a protective enclosure for anelectronic device;

FIG. 7 is a front view of a protective enclosure for an electronicdevice; and

FIG. 8A is a side section view of a protective enclosure;

FIG. 8B is an enlarged section view from FIG. 8A;

FIG. 9 is a rear perspective view of a protective enclosure for anelectronic device;

FIG. 10 is a rear perspective view of a protective enclosure for anelectronic device;

FIG. 11 is a front isometric view of a protective enclosure for anelectronic device;

FIG. 12 is a front view of a protective enclosure for an electronicdevice;

FIG. 13 is a rear view of a protective enclosure for an electronicdevice;

FIG. 14A is a front view of a protective enclosure for an electronicdevice;

FIG. 14B is a section side view from FIG. 14A;

FIG. 15 is a front isometric exploded view of a protective enclosure foran electronic device; and

FIG. 16 is a rear isometric exploded view of a protective enclosure foran electronic device.

DETAILED DESCRIPTION

The subject matter described herein relates to a protective enclosurefor an electronic device. It is desired to have the electronic deviceprotected from adverse environmental conditions, mishandling and/ordamage, and damage from drops and falls. It is desirable that theprotective enclosure for the electronic device be easy to install and itis desirable for the protective enclosure to be a one-piece enclosure.The protective enclosure can be of any appropriate size and dimension solong as it is capable of housing an electronic device and protecting it,for instance from drops and scratches.

Particularly, in certain embodiments, the protective enclosure can be acase for encasing an electronic device, such as a mobile phone,smartphone, tablet computer, personal digital assistant, camera, GPStracker, health monitor, medical device, such as an insulin pump orglucose monitor, or the like. In other instances, the protectiveenclosure can be part of the electronic device, which protects thevarious components and/or electronic circuitry of the electronic device.For example, the protective enclosure can be the housing of a mobileelectronic device, or smartphone or medical device, which encases theelectronic components of the electronic device.

There are several advantages with the protective enclosure providedherein. In certain exemplary instances, a protective enclosure canprovide a measure of shock absorbance for the electronic device housedwithin the protective enclosure. The protective enclosure can alsoprovide protection against scratching, chipping, breaking, fracturing,and the like of the electronic device and/or a touch screen associatedtherewith, when housed within the protective enclosure. Anotheradvantage of the protective enclosure provided herein is that, invarious particular embodiments, it may be a one-piece assembly, althoughin other embodiments it may be a multi-part assembly that has beenengineered to easily fit together thereby making assembly easy. Thisovercomes the difficulties of some protective enclosures, or cases, forelectronic devices that have multiple components and/or are difficult toassemble and can be confusing and difficult to use.

A protective enclosure of the disclosure may be of any suitable shape,having any suitable size, dependent on the actual dimensions of thedevice it is meant to encase. However, in certain exemplary instances,the dimensions of one class of protective enclosure can fall within thefollowing ranges. The thickness of various members, whether individuallyor when overmolded together, can have a thickness of about 25 mm orless, such as 20 mm or less, for instance, about 15 mm or less,including about 10 mm or less, such as about 8 mm or less, or about 5 mmor less, about 4 mm or less, including about 3 mm or less or about 2 mmor less, for example about 1.5 mm or 1.0 mm or less, even about 0.1 mm.For example, in various instances, such as where an electronic devicesuch as a smartphone, tablet computer, electronic reader, camera, orvideo display is to be contained within the protective enclosure, thethickness of a top portion and/or bottom portion and any side portions,individually or overmolded together, can be less than about 2.5 mm, suchas less than about 2.0 mm, less than about 1.5 mm, for example less than1 mm thick, even about 0.1 mm thick. However, in other instances, thethickness of various members, whether individually or when overmoldedtogether, can have a thickness of about 30 mm or more, such as 40 mm ormore, for instance, about 50 mm or more, including about 60 mm or more,such as about 80 mm or more, or even about 100 mm or more.

In certain instances, such as where an electronic device such as asmartphone, tablet computer, electronic reader, camera, or video displayis to be contained within the protective enclosure, the weight of anyportion of the protective enclosure, individually or overmoldedtogether, can be less than about 5 or about 4 ounces, less than about 4or about 3 ounces, for instance, less than about 2 or about 1 ounce,including less than about 28 or about 27 grams. Accordingly, in oneembodiment, due to the design features described herein, a protectiveenclosure can be capable of providing shock and drop protection to anelectronic device housed within the protective enclosure while onlyhaving a thickness and/or weight range in the recited above. However, invarious instances, an enclosure of the disclosure may have a weight andconstruction that is substantially greater than the above, such as morethan about 10 or about 20 ounces, more than about 30 or about 50 ounces,for instance, more than about 60 or about 80 ounce, including more thanabout 100 ounces.

Further, in certain instances, the length and/or width of the protectiveenclosure may be such that it is no longer or wider than about 25 mm ofthe underlying electronic device it is designed to encase, no longer orwider than about 20 mm or about 15 mm, for instance, no longer or widerthan about 10 mm, including no longer or wider than about 5 mm of theunderlying electronic device the protective enclosure is designed toencase. Accordingly, in certain instances, a protective enclosure isconfigured to be substantially form fitting with the electronic deviceit is meant to contain. However, in various instances, an enclosure ofthe disclosure may be substantially longer or wider than the dimensionslisted above, such as, for instance, longer or wider by about 50 mm ofthe underlying electronic device it is designed to encase, longer orwider by about 75 mm or about 85 mm, for instance, longer or wider byabout 100 mm than the underlying electronic device the protectiveenclosure is designed to encase.

To ensure the appropriate thickness, length, and/or width and/or weightof the protective enclosure have been provided, the electronic devicecan be fitted into the protective enclosure and the protective enclosurecan be tested for its ability to provide shock and drop protection, suchas by experimentally dropping the protective enclosure and electronicdevice. In some instances, the protective enclosure with the electronicdevice housed within can be tested to specific drop standards or evenmilitary standards in order to comply with certain specifications setforth by the guarantees of the protection that the protective enclosurecan provide for the electronic device. The thickness, length, and/orwidth and/or weight of the protective enclosure should be provided insuch dimensions so that the retained electronic device is not broken,cracked, or otherwise damaged by the dropping and testing.

It is to be understood that although particular embodiments arepresented herein, such as a protective enclosure for an electronicdevice, the electronic device comprising a mobile phone, tabletcomputer, electronic reader, camera or the like, the device housed maybe any number of different shapes, sizes, and configurations, and assuch, the herein disclosed enclosures can be of any number of differentshapes, sizes, and configurations without departing from the nature ofthe disclosure. For instance, as herein depicted below, and inreferences to the appended figures, the protective enclosure may includetop portions, such as frame members, and top wall portions, such aswalls extending below a surface of a top portion surface, such assubstantially normal or at an angle thereto; as well as bottom portionsand/or bottom wall portions, such as walls extending above a surface ofa bottom portion, e.g., substantially normal or at an angle thereto, andmay as well include side portions and perimeter portions, all of whichmay be configured so that the protective enclosure of the disclosure maybe formfitting to the device it is designed to protect. In certaininstances, the protective enclosure can be configured so as not to need,and in various instances, does not have any one of the portions or wallportions listed above or a combination of one or more of the portionslisted above. Hence, the scope of the protective enclosures describedherein with respect to the particular embodiments set forth in referenceto the figures is not intended to be unduly limiting.

Accordingly, in one aspect, a protective enclosure for an electronicdevice is provided. Typically, the electronic device may be a devicethat needs protection from droppage and mishandling and/or damage. Forinstance, the electronic device can be a mobile phone or tabletcomputer. In other instances, the electronic device can also be adigital assistant, a computer, a camera, music player, GPS device, orthe like. In typical configurations, the electronic device will have afront surface that may include a capacitive sensing touch screen. Insome embodiments, the front surface of the electronic device mayalternatively or additionally have a keyboard or buttons, e.g., alongwith a touch screen or other display. The electronic device will have aback surface and together with the front surface the electronic devicewill be surrounded by a perimeter portion.

Hence, the typical electronic device will have side surfaces, includinga top and bottom-side surface and edge as well as opposing side surfacesand respective edges. The side surfaces along with the front surface andbottom surface provide the housing of the electronics, battery, andother components of the electronic device. The front and side surfacesof the electronic device can also have additional features of theelectronic device, including buttons and controls and access points. Forinstance, the electronic device can have buttons and controls that alongwith the touch screen make the electronic device function fully. Thebuttons on the electronic device can be a power button, can be volumecontrols, can be a silencing toggle, and in some instances the buttonscan be a keyboard or other controls for enabling the electronic deviceto function.

As is typical, the electronic device can also have a camera. The cameracan be located on a surface of the electronic device and in someinstances can be located on the front and/or back surface of theelectronic device. The camera can include a flash and in some instancesother features might be located near the camera of the electronicdevice, including a speaker, microphone, or other sensors. Theelectronic device may also have one or more microphones, for picking upsounds, and/or one or more speakers for transmitting sounds. Themicrophones and/or speakers can be located on a surface of theelectronic device and in some instances can be located along a perimetersurface of the electronic device and on a bottom surface of theelectronic device. The electronic device can also have accessible areasfor power connections and for headphone connections. These areas can belocated along a surface of the electronic device and in some instancesbe located on the bottom surface of the electronic device. Accordingly,in various instances, as described herein, the protective enclosures ofthe disclosure may have various features and configurations, such ascutouts and/or expanded flexible regions that may be configured toaccommodate such features, such as control and/or sound transmissionfeatures, of the underlying device to be enclosed, so as to ensure thecomplete functionality of the electronic device, such as while withinthe case.

Hence, the protective enclosure is configured such that the electronicdevice can fit within the protective enclosure and be protected fromdrops, shocks, damage, misuse, and the like, while also, in many cases,allowing full operation of the various features, as described above, ofthe encased electronic device. In particular, in certain instances, theprotective enclosure can include a bottom shell. The bottom shell canhave an elongated body that has a main surface, such as a bottom surfacesurrounded by a perimeter portion. The bottom surface will have aninterior surface portion, such as a portion that may be configured toengage a surface, such as a back surface of the electronic device, aswell as an exterior our outer surface portion. The main surface willalso have a perimeter portion, and the perimeter portion can include aretaining wall that can extend from the main surface of the bottomshell, so as to be substantially normal or angled thereto, such asangled from 1 to 90 degrees in the plus or minus direction from normal.The retaining wall can have a top-side wall portion, a bottom-side wallportion, a left side wall portion, and right side wall portion. In otherinstances, the retaining wall can have only a top-side wall portion,only a bottom-side wall portion, or only side wall portions, or amixture of the same. For example, the retaining wall can have acombination of a top-side wall portion and a side wall portion, or abottom-side wall portion and a side wall portion. And in otherinstances, the retaining wall can only have side wall portions.

In certain embodiments, the wall portions and the surface of the bottomshell can create a cavity. The cavity of the bottom shell can beconfigured to retain and house the electronic device, and the cavity canbe shaped similar to the shape of the electronic device, for instance,so as to be form fitting therewith. In certain embodiments, the cavityof the bottom shell can be shaped to fit a mobile phone. In otherinstances, the bottom shell can be shaped to fit a tablet computer, acamera, a music player, a GPS device, or the like.

In certain embodiments, the wall portions of the bottom shell can be thesame height as the side portions of the electronic device. The wallportions can also be a portion of the height of the side portions of theelectronic device. In other embodiments, the wall portions of the bottomshell can only be a small portion of the side portions of the electronicdevice, only wrapping around the change in surface from the back of theelectronic device to the side surface of the electronic device.

As indicated, the elongated body of the bottom shell will have an innersurface and an outer surface. The outer surface can be the surface thata user of the electronic device feels when the electronic device isinstalled into the protective enclosure. In certain instances, the outersurface of the bottom shell can extend around to the top-side wallportion, the bottom-side wall portion, and/or the side wall portions ofthe bottom shell. In other embodiments, the outer surface of the bottomshell of the protective enclosure can extend around only the top-sidewall portion, only the bottom-side wall portion, only the side portions,or in other embodiments a combination of the wall portions of the bottomshell.

In certain embodiments, the bottom shell of the protective enclosure canhave one or more cut out regions. The cut out regions can be locatedalong the left side wall portion and the right side wall portion and/ora top or bottom side wall portion. Accordingly, in other instances, thecut out regions can be located on the top-side wall portion and/or thebottom-side wall portion. The cutouts can be the size of a portion ofone of the wall portions of the bottom shell or the cut out regions canbe the entire size of one of the wall portions of the bottom shell thatthe cutout is located. In other instances, one cut out region of thebottom shell can be a different size than another cutout of the bottomshell in the same protective enclosure. The cut out regions of thebottom wall of a protective enclosure can be adapted to accommodate anovermolded material to fill in the cut out regions, such as from aprimary and/or secondary cushioning layer, as described herein below. Incertain embodiments, the cutouts are located along the left and rightside walls of the bottom shell to accommodate a bending of the bottomshell along the elongated body of the bottom shell and/or they may beposition along the top and/or bottom side wall portions. In certainembodiments, the bending of the bottom shell can assist with insertingan electronic device into the protective enclosure.

In certain embodiments, the bottom shell of the protective enclosure canhave a camera feature and camera opening. The camera feature can includea camera and/or a flash lens portion, and may include an actual lens,and can be located on the outer surface of the bottom shell and in someinstances can be aligned with the camera of an electronic device. Thecamera opening can be the same shape as the camera and/or flash of theelectronic device or in certain embodiments can be larger than the sizeof the camera of the electronic device, and may have a gasket or otherconfiguration to prevent the transmission of light from the flash intothe camera lens. In various instances, the perimeter of the case portionencircling the camera feature may at least be partially configured toblock light transmission, such as by having a darkened region borderingthe circumference of the camera feature portion.

In certain embodiments, the camera feature of the bottom shell can bealigned with the camera of a tablet computer or can be aligned with thelens portion of a camera. The camera feature can be of the same materialand color of the bottom shell or in other instances can be a specificcolor to prevent any distortion of the camera usage of the electronicdevice when the electronic device is retained in the protectiveenclosure. In some instances, the color of the camera feature can beblack or a dark color.

In certain embodiments, the bottom shell of the protective enclosure canhave a protrusion on the inner surface of the bottom shell, such as inthe middle center of the surface. The protrusion can be shaped tointeract with a feature of the protective enclosure, and in someembodiments can interact with on overmolded layer that fits on the innersurface of the bottom shell of the protective enclosure.

Additionally, in certain embodiments, the protective enclosure caninclude one or more cushioning layers, such as a first cushioning layer.The first cushioning layer can comprise a front surface and a backsurface. In certain embodiments the first cushioning layer can have aproximal portion, a distal portion, and side portions, as well as afront and back surface. In certain embodiments, the first cushioninglayer can have an elongated body defined by the shape of the frontsurface and of the back surface, and may have raised and/or indentedsections creating a matrix of surface configurations, so as to help withshock absorbance and/or sound transmission. In various instances, thefirst cushioning member has a surface that has contoured regions, e.g.,raised regions that divide the surface into a plurality of differentsub-compartments, wherein each sub-compartment may be of the same shapeand/or area or of differing shapes and/or areas.

The back surface of the first cushioning layer of certain embodiments ofthe protective enclosure can be overmolded onto the inner surface of thebottom shell and create a back portion of the protective enclosure thathouses an electronic device. In other embodiments, the first cushioninglayer can be overmolded onto the inner surface of the bottom shell alongthe top-side wall portion, along the bottom-side wall portion, along theleft side wall portion and along the right side wall portion, or anyvariation of the wall portions. In certain embodiments, the frontsurface of the first cushioning layer can be configured so as to restagainst the back surface of the electronic device and provide protectionto the electronic device when installed into the protective enclosure.In other embodiments the first cushioning layer can have a depression onthe back surface. The depression can interact or engage with theprotrusion or nub in the inner surface of the bottom shell. Thedepression and protrusion can interact to assist with alignment duringthe overmolding process between the bottom shell and the firstcushioning layer of the protective enclosure.

Further, in certain embodiments, the protective enclosure can alsoinclude a second cushioning layer. The second cushioning layer can alsoact as a framework member for the protective enclosure that retains anelectronic device. The framework member may be configured so as toinclude a surface that is surrounded by a perimeter portion. Theperimeter portion can be configured to include a perimeter wall. Theperimeter wall can include a top wall portion, a bottom wall portion,and opposing side wall portions. In other embodiments, the perimeterportion can only include a top wall portion, or can only include abottom wall portion, or can only include opposing side wall portions, orany combination of wall portions.

In certain embodiments, the perimeter portion of the framework membercan be overmolded with the retaining wall of the bottom shell. Invarious instances, the perimeter portion of the framework member can beadapted to form-fit over a perimeter portion of the electronic device.The framework member can be formed to create an elevated protective rimaround the perimeter of the electronic device, creating a gap betweenthe front face of the electronic device and a surface that theprotective enclosure may rest on.

In certain embodiments, the overmolding of the bottom shell, the firstcushioning layer, and/or the second cushioning layer can make thesecomponents of the protective enclosure inseparable and can make theprotective enclosure a one-piece article. In other instances, one ormore of these components can remain separate units that are configuredso as to be easily assembled, disassembled, and fitted around the deviceto be protected. In various instances, the second cushioning layer canhave an expanded portion along any of the side wall portions of thesecond cushioning layer. The expanded portions can be overmolded to fitwithin the cut out regions on the bottom shell and in some embodimentsthe expanded portions can bend along the perimeter portion of the bottomshell and the second cushioning layer and bend the protective enclosureso as to insert or remove an electronic device more easily.

Hence, in certain embodiments, the framework member can be multiplecomponents that overmold onto the bottom shell. The multiple componentscan be comprised of a top component, a bottom component, and sidecomponents. The protective enclosure can include one or more than one ofthe individual components of the framework member that overmold onto thebottom wall and comprise the protective enclosure that surrounds andhouses the electronic device. The framework member can also beconfigured to include a plurality of openings. The openings in theframework member or an individual component of the framework member canbe located on any wall portion of the framework member and in someinstances can be located along the bottom wall portion of the secondcushioning layer or framework member. The openings in the frameworkmember can provide access to a component, e.g., a control or soundfeature, of the electronic device. In some embodiments, the openings canprovide access to a power port, headphone jack port, or a silencingtoggle of the electronic device. When the framework member is overmoldedwith the bottom shell of the protective enclosure, the openings of theframework member or second cushioning layer can be located within thecut out regions of the bottom shell.

In certain embodiments, the framework member can include a soundfeature. This sound feature can be located in the same location as thespeaker of the electronic device when the electronic device is insertedinto the protective enclosure. The sound feature of the framework membercan provide access to the sound emitted from the electronic device. Inother instances, the sound feature of the framework member, or secondcushioning layer, can be located near the volume controls of theelectronic device. When the electronic device is housed within theprotective enclosure, the sound features of the second cushioning layercan be engaged to interact with the volume controls of the electronicdevice and volume can be increased or decreased by engaging the soundfeatures of the second cushioning layer.

In certain embodiments, the sound features of the second cushioninglayer are located within the cut out regions on the bottom wall when thebottom wall and second cushioning layer are overmolded together as theprotective enclosure. By having the sound features located within thecut out regions of the bottom wall, the volume controls are easilyengaged thru the second cushioning layer and can be easily depressed inorder to change the volume of the electronic device when housed withinthe protective enclosure.

Hence, in certain embodiments, the second cushioning layer of theprotective enclosure can be configured to include a control feature. Thecontrol feature can be located on any wall portion of the secondcushioning layer, or framework member, and in some instances can belocated on a side wall portion. When the electronic device is retainedwithin the protective enclosure, the control feature of the frameworkmember can be located over the power button, volume button, orientationbutton, etc. of the electronic device. These buttons of the electronicdevice can then be activated through the framework member, or secondcushioning layer, while retaining the electronic device within theprotective enclosure. In some embodiments, the control feature of thesecond cushioning layer can be located within the cut out region of thebottom shell when overmolded together to make the protective enclosure.Having the control feature within the cut out region of the bottom wallallows for the second cushion layer to interact with the power buttonand engage the button to turn the electronic device, which in someinstances can be a mobile phone, on and off.

The details of one or more variations of the subject matter describedherein are set forth in the accompanying drawings and the followingdescription. As can be seen with respect to FIG. 1, FIG. 2A, FIG. 2B,FIG. 3A and FIG. 3B, the protective enclosure is one embodiment 100 thatcan include a one-piece multiple layered case that retains and houses anelectronic device. As can be seen with respect to FIG. 9 and FIG. 10,the protective enclosure is one embodiment 900 that can include aone-piece multiple layered case that retains and houses an electronicdevice. As can be seen with respect to FIG. 11, FIG. 12 and FIG. 13, theprotective enclosure is one embodiment 1100 that can include a one-piecemultiple layered case that retains and houses an electronic device.

As can be seen with respect to FIG. 1, FIG. 2A, FIG. 2B, FIG. 3A andFIG. 3B, the protective enclosure is one embodiment 100 that can includea one-piece multiple layered case that retains and houses an electronicdevice. As can be seen with respect to FIG. 9 and FIG. 10, theprotective enclosure is one embodiment 900 that can include a one-piecemultiple layered case that retains and houses an electronic device. Ascan be seen with respect to FIG. 11, FIG. 12 and FIG. 13, the protectiveenclosure is one embodiment 1100 that can include a one-piece multiplelayered case that retains and houses an electronic device.

It is to be understood that although particular embodiments arepresented herein, such as a protective enclosure for an electronicdevice, the electronic device comprising a mobile phone, tabletcomputer, electronic reader, camera or the like, the device housed maybe any number of different shapes, sizes, and configurations withoutdeparting from the nature of the disclosure. For instance, as hereindepicted below, the protective enclosure may include top portions andtop wall portions, bottom portions and bottom wall portions, sideportions and perimeter portions. In certain instances, (not shown) theprotective enclosure cannot have any one of the portions or wallportions listed above or a combination of one or more of the portionslisted above. Hence, the scope of the protective enclosures describedherein with respect to the particular embodiments set forth in referenceto the figures in not intended to be unduly limiting.

Accordingly, with respect to FIG. 1, embodiment 100 is a protectiveenclosure 102 for an electronic device 500 (not shown). The protectiveenclosure 102 can include a cushion layer 200 surrounded by a structurallayer 300. The structural layer can also be referred to as a bottomshell. The cushion layer 200 and the structural layer 300 can beovermolded to form a one-piece protective enclosure 102 that form-fitsto surround an electronic device 500. As can be seen in FIG. 2A and FIG.2B, the structural layer 300 can have a back portion 302, a left wallportion 304, a right wall portion 306, a top wall portion 308, and abottom wall portion 310. The structural layer can also be referred to asa bottom shell or shell of the protective enclosure. The wall portionsof the structural layer 300 can also be referred to as a retaining wall.The shape and height of the wall portions can vary, but can extend alongthe shape of the electronic device creating a cavity for the electronicdevice. The transition between a back portion 302 to a right wallportion 306, a left wall portion 304, a top wall portion 308 and abottom wall portion 310 of a structural layer can be an edge or a smoothtransition.

The structural layer 300 can have a first gap 312 in the left wallportion 304 and can have a second gap 314 in the right wall portion 306.The gaps can also be referred to as cut out regions or cutouts of thestructural layer, or bottom shell. The first gap 312 and second gap 314can span a distance along the left wall portion 304 and the right wallportion 306. In other embodiments, the structural layer can have a firstgap and a second gap in a top wall portion and a bottom portion. Thegaps in the right wall portion and left wall portion can be locatedanywhere along the left wall portion and right wall portion. The firstgap and second gap can be located in the same location on each wallportion or can be offset from each other on either wall portion.

The material used to create and form the structural layer 300 can be anysuitable material such as a thermoplastic polymer or a syntheticpolymer. The structural layer 300 can include polycarbonate, nylon, orglass filled nylon. Alternately, any other material, or combination ofmaterials, that provide rigidity to the protective enclosure 102 can beused. The structural layer 300 can be formed using any suitable process,such as and injection molding process. The material used to form thestructural layer 300 can be scratch-resistant and can provide a surfaceon the back portion 302 to add stylistic patterns or images.

The cushion layer 200 can have an interior portion 206, a top portion208, and a bottom portion 210. The cushion layer 200 can be made of anysuitable material such as an elastomer. The elastomer can be athermoplastic elastomer or silicone rubber. In one embodiment, thecushion layer 200 can be overmolded within a cavity portion of thestructural layer 300 and form-fit to the dimensions and size of theelectronic device 500. The cushion layer 200 can be overmolded on two ormore portions on the structural layer 300 and in one embodiment candefine the entire cavity between the structural layer 300 and theelectronic device 500.

The cushion layer 200 can be overmolded within the cavity of thestructural layer 300 and extend across the first gap or cut out region312 in the left wall portion 304 of the structural layer 300 creating afirst flexible wall portion 202 and can be overmolded and extend acrossthe second gap 314 in the right wall portion 306 of the structural layer300 creating a second flexible wall portion 204. The first and secondflexible wall portions of the cushion layer 300 that extend across thegap or cut out regions of the structural layer can also be referred toas an expanded portion of the cushion layer. The cushion layer can havean expanded portion on the left wall portion and have an expandedportion on the right wall portion of the cushion layer that comprises apart of the protective enclosure. The first flexible wall portion 202and the second flexible wall portion 204 can provide flex and stretchand can allow the back portion 302 of the structural layer 300 todistort away from a back surface 502 of the electronic device 500 foreasy insertion and removal of an electronic device 500 from theprotective enclosure 102, as shown in FIG. 4.

From the overmolded construction of the structural layer 300 and thecushion layer 200, the protective enclosure 102 provides a one-piececonstruction that functions like, and provides benefits similar to, amore costly and complicated two-piece or three-piece construction. Theprotective enclosure 102 provides a soft surface against the electronicdevice 500 with the cushion layer 200 and also provides a rigidity withthe structural layer 300 to protect against impacts and to give theprotective enclosure 102 a smooth feel. The structural layer 300 and thecushion layer 200 can be created in a number of variations of colorcombinations and in some embodiments be transparent for more visualaccess to the electronic device 500.

The cushion layer 200 and the structural layer 300 can have the samethickness throughout the protective enclosure 102 and in otherembodiments can vary in thickness. This thickness can vary depending onthe manufacturing process and design of the protective enclosure.

The cushion layer 200 can provide a raised beveled edge 222 to protectthe electronic device 500 from direct contact with surfaces while in theprotective enclosure 102. The raised beveled edge 222 of the cushionlayer can also be referred to as an elevated protective rim. The raisedbeveled edge 222 of the cushion layer 200 can surround the left wallportion 304, the right wall portion 306, the top wall portion 308, andthe bottom wall portion 310 of the structural layer 300 or in otherembodiments can be a sectional raised beveled edge extending from one ormore wall portions. In other embodiments, the raised beveled edge can beformed from the structural layer to protect the surface of theelectronic device.

The first gap or cut out region 312 and the second gap or cut out region314 of the structural layer 300 can be located along any part of theleft wall portion 304 and the right wall portion 306. In one embodimentthe first gap 312 and the second gap 314 are located closer to the topwall portion 308 of the structural layer 300 as shown in FIG. 2. Inanother embodiment, the first gap 312 and the second 314 can be locatedcloser to the bottom wall portion of the structural layer 300.

The cushion layer 200 can provide openings 212 and the structural layer300 can provide openings 320 for access to features of the electronicdevice 500. These features can include the power cable access, speakeraccess, microphone access, and headphone jack access. The openings 200and 320 can be a general opening or can be formed openings to mimic thefeature that they are providing access to on the electronic device 500for greater protection of the electronic device 500, as shown in FIG. 2.

The structural layer 300 can provide openings 320 for the cushion layer200 to provide functional coverings 220 for the electronic device 500.These functional coverings of the cushion layer can also be referred toas control features and in some instances can be referred to as soundfeatures. These functional coverings 220 can include the power buttonand volume buttons. The functional coverings 220 can have flexibleproperties due to the material structure of the cushion layer 200. Theprotective enclosure 102 is designed to provide access to all featuresof the electronic device 500 with the openings 320 and 212 andfunctional coverings 220 so that a user does not need to remove theelectronic device 500 from the protective enclosure 102 in order to usethe features of the electronic device 500.

The cushion layer 200 can provide a camera opening 214 for theelectronic device 500. The structural layer 300 can have a cameraopening 316 that mimics the shape of the camera opening 214 in thecushion layer 200 for access to the camera 504 of the electronic device500, as shown in FIG. 2. The camera opening 316 of the structural layer300 can have a printed surface 318 that surrounds the camera opening 316and does not hinder the color accuracy of the camera 504 while theelectronic device 500 is installed in the protective enclosure 102. Inone embodiment, the color of the printed surface 318 is black. In otherembodiments, the printed surface 318 can be other dark colors.

The cushion layer 200 can have an interior portion 206 that lines thecavity created by the back portion 302 of the structural layer 300. Theinterior portion 206 can have raised portions 216 and sunken portions218, as shown in FIG. 1 and FIG. 3. The raised and sunken portions ofthe interior portion of the cushion layer can be located on a frontsurface and a back surface of the cushion layer. These raised portions216 and sunken portions 218 can provide an air gap between sections theinterior portion 206 of the cushion layer 200 and a back surface 502 ofan electronic device 500. The air gaps between the sunken portions 218of the cushion layer 200 and the back surface 502 of the electronicdevice 500 can provide extra cushion protection for the electronicdevice 500 while it is surrounded by the protective enclosure 102. Inother embodiments, raised portions and sunken portions on the interiorportion of the cushion layer can be along the walls of the protectiveenclosure.

In one embodiment 100, a slot 402 can be created where the parting area400 of the structural layer 300 and the cushion layer 200 overmoldtogether to form the protective enclosure 102. The slot 402 can be anarea that aids in manufacturing for the overmold to have a clean shutoffregion and the slot 402 can hide potential flash created duringmanufacturing. The slot 402 can be used as a visual effect for theprotective enclosure 102 and the slot 402 can also be used as a trackfor sliding on other accessories or components to the protectiveenclosure. The slot 402 can be formed along any wall portion orperimeter portion of the structural layer and of the cushion layer. Theslot 402 can extend around the entire perimeter portion of theprotective enclosure or extend around only a portion of the perimeterportion. The slot 402 can also extend for a distance around theperimeter portion and stop, and then start again at another locationaround the perimeter portion of the structural layer and cushion layer.Other accessories can include mounts and battery accessories to aid inthe use of the electronic device within the protective enclosure. Slot402 can be a thickness and depth of 0.10 in, and can vary in thicknessand depth depending on the manufacturing process and design. In otherembodiments, the parting area between the structural layer and thecushion layer can be a smooth transition.

In embodiment 600 on shown in FIG. 5 and FIG. 6, a cushion layer 700 canbe overmolded within the cavity of the structural layer 800. Thestructural layer can also be referred to as a bottom shell. The backportion 802 of the structural layer 800 can have a thinner portion 816that spans along the back portion 802 of the structural layer. Thethinner portion 816 can extend along the back portion 802 of thestructural layer 800 from the left wall portion 804 of the structurallayer 800 to the right wall portion 806 of the structural layer 800. Insome embodiments, the thinner portion 816 can extend only a portion ofthe distance along the back portion 802 of the structural layer. In evenother instances, the thinner portion 816 can comprise multiple portionsof the back portion, the multiple portions extending along the backportion 802 of the structural layer 800.

As shown in the cross-section view 602 and the enlarged view 604 of FIG.8A and FIG. 8B, the thinner portion 816 of the back portion 802 of thestructural layer 800 can be 0.01 in. thinner than the other parts of thestructural layer. This portion can be greater or smaller than 0.01 in.In other embodiments, the back portion of the structural layer does nothave a thinner portion and can have a uniform thickness along the backportion of the structural layer and from left wall portion and the rightwall portion of the structural layer.

The thinner portion 816 of the back portion 802 of the structural layercan be located anywhere along the back portion. In embodiment 600 thethinner portion 816 is located closer to the top portion of theprotective enclosure 606 than the lower portion. In other embodiments,the thinner portion of the back portion of the structural layer can belocated within the first gap and second gap of the structural layer andwithin the first flexible wall portion and second flexible wall portionof the cushion layer. The thinner portion of the back portion of thestructural layer can assist with flexing of the back portion of thestructural layer when the flexible wall portions of the cushion layerare stretched to distort the back portion of the structural layer forease in inserting and removing an electronic device.

Embodiment 900, shown on FIG. 9 is a protective enclosure 902 for anelectronic device. The protective enclosure 902 can include a cushionlayer 910 surrounded by a structural layer 960. The structural layer canalso be referred to as a bottom shell. The cushion layer 910 and thestructural layer 960 can be overmolded to form a one-piece protectiveenclosure 902 that form-fits to surround an electronic device.

The structural layer 960 can have a back portion 970, a left wallportion 964, a right wall portion 966, and a top wall portion 968. Theback portion 970 can also be referred to as an elongated body thatincludes an inner surface and an outer surface. The left wall portion ofthe structural layer can also be referred to as a left side wallportion. The right wall portion 966 of the structural layer 960 can alsobe referred to as a right side wall portion. The top wall portion 968can also be referred to as a top-side wall portion. The shape and heightof the wall portions can vary, but can extend along the shape of theelectronic device creating a cavity for the electronic device. Thestructural layer 960 can have a gap 962 between the left wall portion964, the right wall portion 966 and the back portion 970. The gap 962can also be referred to as a cut out region and in some instances can bereferred to as cutouts of the structural layer or bottom shell.

The cushion layer 910 can be overmolded on two or more portions on thestructural layer 960 and the cushion layer 910 can extend from the leftwall portion 964, the right wall portion 966 and the back portion 970 ofthe structural layer 960 to form a bottom flexible wall portion 912. Thebottom flexible portion can also be referred to as an expanded portionof cushion layer. This bottom flexible wall portion 912 can be flexibleenough to bend and extend towards the back portion 970 of the structurallayer 960 and away from an electronic device within the protectiveenclosure 902 for ease of insertion and removal of the electronic deviceto and from the protective enclosure 902.

In another embodiment, the cushion layer of the protective enclosure canbe separated into two members. In even other embodiments, the cushionlayer of the protective enclosure described herein could be separatedinto more than two members. These multiple members of the cushion layercan then be overmolded to the structural layer, or bottom shell, andcontinue to act as a cushion layer to protect the electronic device wheninserted into the protective enclosure from drops, falls, scratches,dents, and other damage.

As seen in FIG. 11-FIG. 16, Embodiment 1100 illustrates a protectiveenclosure 1102 for an electronic device 1000 (not shown). The protectiveenclosure 1102 includes a bottom shell 1200. The bottom shell caninclude an elongated body 1202 that has an inner surface 1204 and anouter surface 1206. The inner surface 1204 and the outer surface 1206can create an elongated body 1202 of the bottom shell 1200. Theelongated body 1202 including the inner surface 1204 and the outersurface 1206 are surrounded by a perimeter portion 1224.

The perimeter portion 1224 of the bottom shell 1200 defines a retainingwall 1208. The retaining wall 1208 is formed by a top-side wall portion1210, a bottom-side wall portion 1212, a left side wall portion 1214,and a right side wall portion 1216. The bottom shell can be formed froma rigid or semi-rigid material, such as polycarbonate material. Thebottom shell 1200 can also include a nylon or glass-filled nylon.

The bottom shell 1200 can include a cut out region 1218. The cut outregion can also be referred to as cutout or a gap in the bottom shell1200. The cut out region or more than one cut out region 1218 can belocated along the right side wall 1210 and left side wall portion 1214of the retaining wall 1208. The cut out region 1218 can comprise theentire height of the left side wall portion 1214 and right side wallportion 1216 or can be a portion of the height of the left side wallportion 1214 and right side wall portion 1216. The cutout region 1218can extend along the left side wall portion 1214 and right side wallportion 1216 and can include a region of access to volume controls 1008(not shown), and power control 1010 (not shown) of the electronic device1000 when the electronic device is housed within the protectiveenclosure 1102.

The cutouts 1218 can also be located along the top-side wall portion andalong the bottom-side wall portion. The cutouts 1218 can be only locatedon the top-side wall portion, the bottom-side wall portion, left sidewall portion and right side wall portion or a plurality of cutouts 1218can be located on any of the wall portions of the bottom shell 1200.

The bottom shell 1200 of the protective enclosure 1102 can include acamera feature 1220. The camera feature 1220 can be provided on theouter surface 1206 of the bottom shell 1200. The camera feature 1220 caninclude a camera opening 1222, the camera opening 1222 extending fromthe outer surface 1206 of the bottom shell 1200 to the inner surface1204 of the bottom shell 1200. The camera feature can comprise the samematerial as the bottom shell 1200 and can comprise a dark color alongthe camera feature 1220. The dark color assists with not interferingwith the camera functions of the electronic device 1000 when housedwithin the protective enclosure 1102.

The bottom shell 1200 of the protective enclosure 1102 can include aprotrusion 1226. The protrusion 1226 can be located on the inner surface1204 of the bottom shell 1200 and extend away from the inner surface1204. The protrusion 1226 can be any size and shape and be locatedanywhere on the inner surface 1204 of the bottom shell 1200. FIG. 15shows the protrusion 1226 centered in between the left side wall portion1214 and the right side wall portion 1216 and centered between thetop-side wall portion and bottom-side wall portion of the bottom shell1200.

The protective enclosure 1102 of embodiment 1100 can also include afirst cushioning layer 1300. The first cushioning layer 1300 cancomprise an elongated body 1302 defined by a proximal portion 1304, adistal portion 1306, and side portions 1308. The first cushioning layercan have a front surface 1310 and a back surface 1312.

When utilized as part of the protective enclosure 1102, the firstcushioning layer 1300 can be overmolded onto the bottom shell 1200 ofthe protective enclosure 1102. The back surface 1312 of the firstcushioning layer 1300 can be overmolded to the inner surface 1204 of thebottom shell 1200. The first cushioning layer 1300 can mimic the shapeof the inner surface 1204 of the bottom shell 1200. The first cushioninglayer 1300 can be the same size as the perimeter portion 1224 of thebottom shell 1200. In some instances the first cushioning layer 1300 canbe smaller in size than the shape of the inner surface 1204 of thebottom shell 1200. As shown in FIG. 12, the first cushioning layer 1300mimics the shape of the inner surface 1204 but is smaller in size of theinner surface 1204 of the bottom shell 1200.

The first cushioning layer 1300 can extend along the back surface 1004of an electronic device 1000 (not show), protecting the back surfacewithin the protective enclosure 1102. The first cushioning layer 1300can be a solid component or can have openings throughout the elongatedbody 1302. The openings can make the first cushioning layer 1300 lighterin weight when overmolded in the protective enclosure 1102. The openingsof the first cushioning layer 1300 can also be configured to act as askeletal frame for added shock and drop protection when the electronicdevice 1000 is retained and housed in the protective enclosure 1102.

The first cushioning layer can be composed of a flexible material, suchas TPE, to function as a layer within the protective enclosure 1102 thatcan absorb shock away from the electronic device 1000 due to impact or adrop. The first cushioning layer can be any color or texture, and canvary in color and texture from the bottom shell.

The first cushioning layer 1300 includes a depression 1314. Thedepression can be located on the back surface 1312 of the firstcushioning layer 1300. The depression 1314 can be any size and shape andas shown in FIG. 16 the depression can be the exact opposing size andshape of the protrusion 1226 of the bottom shell 1200. The depression1314 of the first cushioning layer 1300 and the protrusion 1226 of thebottom shell 1200 can act as a guide or set point for the protectiveenclosure 1102 during assembly, ensuring that the bottom shell 1102 andthe first cushioning layer 1300 overmold in the correct position for theprotective enclosure 1102 to properly protect the electronic device1000.

The protective enclosure 1102 of embodiment 1100 can also include asecond cushioning layer 1400. The second cushioning layer can also bereferred to as a framework member. The framework member 1400 can includea surface 1402 defining a perimeter portion 1404 of the framework member1402. The perimeter portion 1404 can include a top wall portion 1406, abottom wall portion 1408, and side wall portions 1410. The top wallportion 1406, the bottom wall portion 1408 and the side wall portions1410 can be of any length and in the protective enclosure 1102 can bethe same size and shape as the wall portions of the bottom shell 1200.The wall portions of the bottom shell 1200 and the wall portions of theframework member 1400 can then form-fit to the size and shape of thewall portions of an electronic device 1000.

The framework member 1400 can be overmolded to the back shell 1200,where the top wall portion 1406 of the framework member 1400 overmoldsto the top-side wall portion 1210 of the retaining wall 1208 of thebottom shell, the bottom wall portion 1408 of the framework member 1400overmolds to the bottom-side wall portion 1212 of the retaining wall1208 of the bottom shell 1200, the side wall portions 1410 of theframework member 1400 overmold to the left side wall portion 1214 andthe right side wall portion 1216 of the retaining wall 1208 of thebottom shell 1200. A combination of only some the above overmoldedportions can also be included in some instances. For example, FIG. 10shows protective enclosure 902 in which no overmolding occurs along thebottom flexible wall portion 912 of the protective enclosure 900.

The perimeter portion 1404 of the framework member can be overmolded anddesigned to extend above a front surface of the electronic device 1000when the electronic device is housed and retained in the protectiveenclosure 1102. By extending beyond and above a front surface of theelectronic device 1000, the protective enclosure 1102 can protect thecapacitive sensing touch screen of the electronic device. The perimeterportion 1404 can extend beyond the front surface of the electronicdevice 1000 around the entire perimeter of the front surface of theelectronic device or can extend above the front surface in only certainregions, leaving other regions to be flush with the front surface of theelectronic device.

The framework member 1400 can include one or more expanded portions1418. The expanded portions can also be referred to as flexible wallportions. The expanded portions 1418 can be of the same thickness as thewall portions of the framework member 1400 or can be of a reducedthickness compared to the thickness of the wall portions of theframework member 1400.

The expanded portions 1418 can be located along the side wall portions1410 of the framework member 1400. In other instances, the expandedportions can be located on the top wall portion and/or the bottom wallportion. In protective enclosure 1102 when the framework member 1400 isovermolded with the retaining wall 1208 of the bottom shell 1200, theexpanded portions 1418 of the framework member 1400 are located in thesame location as the cut out regions 1218 of the bottom shell 1200. FIG.13 illustrates the expanded portion 1418 of the framework member 1400overmolded in the same region at the cutouts 1218 of the bottom shell1200. When overmolded together, the cutout region 1218 and expandedportion 1418 create a flush interaction that matches the thickness ofthe other regions of the protective enclosure 1102 where the bottomshell 1200 and framework member 1400 have been overmolded together.

FIG. 4 depicts an example of how the protective enclosure 102 (or 1102)functions to insert and remove an electronic device 500 (or 1000). Withrespect to the protective enclosure 1102, the cut out regions 1218 ofthe bottom shell 1200 and the expanded portion 1418 of the frameworkmember are overmolded together in the top-half region on the protectiveenclosure 1102 (shown as 102). The cut out regions 1218 are similar toand depicted as the second gap 314 of the structural layer 300 and theexpanded portion 1418 is depicted as the second flexible portion 204 ofthe cushion layer 200. When pressure is asserted against the top portion208 and top wall portion 308 of the protective enclosure 102, theprotective enclosure 102 can bend away from the electronic device 500,allowing the electronic device to be inserted or removed from theprotective enclosure. The top portion 208 is similar to the top wallportion 1406 of the protective enclosure 1102 and the top wall portion308 of protective enclosure 102 is similar to the top-side wall portion1210 of the retaining wall 1208 of the protective enclosure 1102.

The framework member 1400 can include a plurality of openings 1412. Theopenings can be located along any of portions of the framework member1400, including the top wall portion 1406, the bottom wall portion 1408,and the side wall portions 1410. As can be seen in FIG. 11 and FIG. 13,the openings 1412 can be located along the wall portions of theframework member 1400 where the cut out regions 1218 are located in thebottom shell 1200 when the framework member 1400 is overmolded to thebottom shell 1200 of the protective enclosure 1102. The openings 1412can provide access to functional aspects of the electronic device 1000when the electronic device is housed and retained within the protectiveenclosure 1102. Functional aspects of the electronic device can includea power control switch, a power access port for charging the electronicdevice, a headphone jack port, and the like.

The openings 1412 of the second cushioning layer or framework member1400 can be the same size as the functional aspect of the electronicdevice that the opening 1412 is aligned with when the electronic device1000 is housed and retained in the protective enclosure 1102 and in someinstances the openings 1412 can be a larger size. A larger size of anopening 1412 can accommodate multiple sizes of accessories needed tointeract with the electronic device 1000 housed and retained in theprotective enclosure 1102. Headphone jacks can be of different sizes,can be power cords and can be plugs of different sizes, all desired tobe accommodated using the protective enclosure 1102 for the electronicdevice.

In other instances, the openings 1412 can have flaps or tabs thatconnect to the wall portions of the framework member and fold over andseal the opening 1412 to keep dust and water away from the functionalaspects of the electronic device while housed and encased in theprotective enclosure 1102. In even other instances, separate plugs canbe available to seal and close the openings 1412, the plugs not beingconnected to the protective enclosure when not in place.

The framework member 1400 can include one or more sound features 1414.The sound feature can be located on any one of the wall portions of theframework member 1400 and a plurality of sound features can be comprisedalong the wall portions of the framework member 1400. In one instance, asound feature 1414 can be located along the bottom wall portion 1408 ofthe framework member 1400. The sound feature 1414 aligns with thespeaker of an electronic device when the electronic device is housed andretained in the protective enclosure 1102. The sound feature 1414 canassist in amplifying the sound from the electronic device through theprotective enclosure 1102.

The sound feature 1414 can be located on the side wall portion 1410 ofthe framework member. The sound feature 1414 can be comprised of aflexible material that can flex when pushed or depressed. The soundfeature 1414 can be located along a portion of the electronic devicewhere the volume control buttons are located. When the electronic deviceis housed and retained in the protective enclosure 1102, the soundfeature 1414 can cover the volume controls of the electronic device andallow depression and activation of the volume controls through theframework member 1400 of the protective enclosure 1102. One or moresound features 1414 can be located over the volume controls of theelectronic device for increasing or decreasing the volume of theelectronic device.

The framework member can include one or more control features 1416. Thecontrol features can be located on any of the wall portions of theframework member 1400. In one instance a control feature 1416 can belocated along the side wall portion 1410 of the framework member 1400and along the cut out region 1218 of the bottom shell 1200 when theframework member 1400 is overmolded to the bottom shell 1200 of theprotective enclosure 1102. When the control feature 1416 is locatedalong the cut out region 1218 of the bottom shell 1200, the controlfeatures 1416 can interact with buttons and control buttons of theelectronic device. These buttons can include a power switch, can includea volume control, can include a silence toggle button, and the like. Thecontrol feature 1416 can be of the same material as the framework member1400 or can be an overmolded material that is more or less flexible thanthe framework member 1400. The flexible material of the control feature1416 allows for activation of a button on the electronic device whilethe electronic device is housed and retained within the protectiveenclosure 1102.

The above figures may depict exemplary configurations for an apparatusof the disclosure, which is done to aid in understanding the featuresand functionality that can be included in the enclosures describedherein. The apparatus is not restricted to the illustrated architecturesor configurations, but can be implemented using a variety of alternativearchitectures and configurations. Additionally, although the apparatusis described above in terms of various exemplary embodiments andimplementations, it should be understood that the various features andfunctionality described in one or more of the individual embodimentswith which they are described, but instead can be applied, alone or insome combination, to one or more of the other embodiments of thedisclosure, whether or not such embodiments are described and whether ornot such features are presented as being a part of a describedembodiment. Thus the breadth and scope of the present disclosure,especially in any following claims, should not be limited by any of theabove-described exemplary embodiments.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing: the term “including” shouldbe read to mean “including, without limitation” or the like; the term“example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; and adjectivessuch as “conventional”, traditional”, “standard”, “known” and terms ofsimilar meaning should not be construed as limiting the item describedto a given time period or to an item available as of a given time, butinstead should be read to encompass conventional, traditional, normal,or standard technologies that may be available or known now or at anytime in the future. Likewise, a group of items linked with theconjunction “and” should not be read as requiring that each and everyone of those items be present in the grouping, but rather should be readas “and/or” unless expressly stated otherwise. Furthermore, althoughitem, elements or components of the disclosure may be described orclaimed in the singular, the plural is contemplated to be within thescope thereof unless limitation to the singular is explicitly stated.The presence of broadening words and phrases such as “one or more”, “atleast”, “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent. Additionally,where a range is set forth, the upper and lower limitations of the rangeare inclusive of all of the intermediary units therein.

The foregoing disclosure has been presented for purposes of illustrationand description. Other modifications and variations may be possible inview of the above teachings. The embodiments described in the foregoingdisclosure were chosen to explain the principles of the invention andits practical application to enable others skilled in the art to bestutilize the invention. It is intended that the claims be construed toinclude other alternative embodiments of the invention except as limitedby the prior art.

What is claimed is:
 1. A protective enclosure for use with an electronicdevice having a front surface, a back surface, and side surfaces, theprotective enclosure comprising: a cushion layer configured to cover atleast a portion of the side surfaces of the electronic device when theelectronic device is installed in the protective enclosure; and astructural layer affixed to the cushioning layer, the structural layerhaving a back portion, a top portion, a right wall portion, and a leftwall portion, the back portion having a first region having a thicknessthat is less than a thickness of a second region of the back portion,the first region configured to allow a section of the protectiveenclosure to flex relative to the back surface of the electronic deviceduring installation and removal of the electronic device from theprotective enclosure.
 2. The protective enclosure of claim 1, whereinthe cushion layer is further configured to cover at least a portion ofthe back surface of the electronic device when the electronic device isinstalled in the protective enclosure.
 3. The protective enclosure ofclaim 1, wherein the left wall portion includes a first gap and theright wall portion includes a second gap.
 4. The protective enclosure ofclaim 3, wherein the first region of the back portion is positioned onthe back portion between the first gap and the second gap.
 5. Theprotective enclosure of claim 3, wherein the cushion layer includes afirst expanded portion extending across the first gap and a secondexpanded portion extending across the second gap.
 6. The protectiveenclosure of claim 1, wherein the first region extends across only aportion of the back portion of the structural layer.
 7. The protectiveenclosure of claim 1, wherein the first region comprises multipleportions extending across the back portion of the structural layer. 8.The protective enclosure of claim 1, wherein the protective enclosure isconfigured to provide an air gap between the protective enclosure andthe back surface of the electronic device when the electronic device isinstalled in the protective enclosure.
 9. A protective enclosure for usewith an electronic device having a front surface, a back surface, andside surfaces, the protective enclosure comprising: a cushion layerconfigured to cover at least a portion of the side surfaces and at leasta portion of the back surface of the electronic device when theelectronic device is installed in the protective enclosure; and a bottomshell affixed to the cushioning layer, the bottom shell having a backportion, a top portion, a right wall portion, and a left wall portion,wherein the back portion has a thinner region having a thickness that isless than a thickness of a thicker region of the back portion, thethinner region configured to permit a section of the protectiveenclosure to flex relative to another section of the protectiveenclosure during installation and removal of the electronic device fromthe protective enclosure.
 10. The protective enclosure of claim 9,wherein the thickness of the thicker region of the bottom shell is 0.01″or less more than the thickness of the thinner region of the bottomshell.
 11. The protective enclosure of claim 10, wherein the thicknessof the thicker region of the bottom shell is more than 0.01″ thickerthan the thickness of the thinner region of the bottom shell.
 12. Theprotective enclosure of claim 9, wherein the left wall portion of thebottom shell includes a first gap and the right wall portion of thebottom shell includes a second gap, wherein the thinner region ispositioned between the first gap and the second gap.
 13. The protectiveenclosure of claim 12, wherein the cushion layer includes a firstexpanded portion extending across the first gap.
 14. The protectiveenclosure of claim 9, wherein the protective enclosure is configured toprovide an air gap between the protective enclosure and the back surfaceof the electronic device when the electronic device is installed in theprotective enclosure.
 15. A protective enclosure for use with anelectronic device having a front surface, a back surface, and sidesurfaces, the protective enclosure comprising: a structural layerdefining a cavity configured to receive the electronic device, thestructural layer including a back portion and a plurality of wallportions, the back portion configured to cover at least a portion of theback surface of the electronic device when the electronic device isinstalled in the protective enclosure, and the wall portions configuredto cover at least a portion of the side surfaces of the installedelectronic device, the structural layer including a first region havinga thickness that is less than a thickness of a second region of the backportion; and a cushion layer positioned within the cavity of thestructural layer, the cushion layer configured to cover at least aportion of the side surfaces and at least a portion of the back surfaceof the electronic device when the electronic device is installed in theprotective enclosure.
 16. The protective enclosure of claim 15, whereinthe plurality of wall portions of the structural layer include a firstwall having a first cutout and a second wall having a second cutout,wherein the first thinner region of the structural layer is positionedbetween the first cutout and the second cutout.
 17. The protectiveenclosure of claim 16, wherein the plurality of wall portions furtherincludes a top wall and a bottom wall, wherein the thinner region ispositioned closer to the top wall than the bottom wall.
 18. Theprotective enclosure of claim 15, wherein the cushion layer includes oneor more openings each configured to allow access to a feature of theelectronic device when the electronic device is installed in theprotective enclosure.
 19. The protective enclosure of claim 15, whereinthe cushion layer includes one or more functional coverings eachconfigured to cover and provide user access to a respective controlbutton of the electronic device when the electronic device is installedin the protective enclosure.
 20. The protective enclosure of claim 15,wherein the structural layer further comprises a camera openingconfigured to align with a camera of the electronic device when theelectronic device is installed in the protective enclosure.